Effect of thiol adsorption on the electrical resistance of copper ultrathin films

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dc.contributor.authorGray, Gabriel
dc.contributor.authorMarin, Francisca
dc.contributor.authordel Campo, Valeria
dc.contributor.authorGonzalez-Fuentes, Claudio
dc.contributor.authorCorrea-Puerta, Jonathan
dc.contributor.authorFlores, Marcos
dc.contributor.authorSegura, Rodrigo
dc.contributor.authorHaberle, Patricio
dc.contributor.authorHenriquez, Ricardo
dc.date.accessioned2025-01-20T16:10:50Z
dc.date.available2025-01-20T16:10:50Z
dc.date.issued2024
dc.description.abstractThe impact of thiol adsorption on thin copper films, covered with a copper oxide layer, was investigated using electrical resistance measurements at various stages: during film growth, aging, exposure to air, and immersion in thiol solutions. Thin copper films (20 nm) were thermally evaporated, with variations in substrate temperature (RT, 330 and 390 K). Films deposited at 330 K exhibited the smallest percolation thickness and aging rates due to their compact morphology, showcasing lower surface roughness and correlation length. Exposure to air led to the formation of a Cu2O 2 O layer on the film surface. Subsequent immersion in a dodecanethiol solution in ethanol resulted in a resistance increase, ranging from 0.1 % to 0.4 %. This change was dependent on the substrate temperature, with the largest difference observed at 330 K. This observation suggests that samples grown at this temperature exhibited the highest electron-surface scattering. Moreover, by depositing a chromium surfactant layer, the impact of this scattering mechanism was amplified, leading to a resistance increase of up to 1.2 %. Mayadas-Shatzkes theory provided a good description of these resistance changes. The negatively charged S-head of the adsorbed thiols alters the electric field experienced by conduction electrons in the Cu2O/Cu 2 O/Cu interface, modifying the electron-surface scattering.
dc.description.funderANID Fondecyt
dc.fuente.origenWOS
dc.identifier.doi10.1016/j.apsusc.2024.160912
dc.identifier.eissn1873-5584
dc.identifier.issn0169-4332
dc.identifier.urihttps://doi.org/10.1016/j.apsusc.2024.160912
dc.identifier.urihttps://repositorio.uc.cl/handle/11534/90233
dc.identifier.wosidWOS:001291731700001
dc.language.isoen
dc.revistaApplied surface science
dc.rightsacceso restringido
dc.subjectCopper
dc.subjectThiols
dc.subjectElectrical transport
dc.subjectUltrathin films
dc.subjectOxidation
dc.titleEffect of thiol adsorption on the electrical resistance of copper ultrathin films
dc.typeartículo
dc.volumen673
sipa.indexWOS
sipa.trazabilidadWOS;2025-01-12
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