Synthesis and thermal, optical and morphological characterization of oligomeric polyamides based on thiophene and alkyl/phenyl-silane moieties. Study of the electrospum deposition process

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dc.contributor.authorJessop Rivera, Ignacio
dc.contributor.authorTundidor Camba, Alain
dc.contributor.authorTerraza Inostroza, Claudio
dc.contributor.authorGonzález Enríquez, Carmen
dc.contributor.authorTagle Domínguez, Luis Hernán
dc.date.accessioned2020-08-13T21:25:18Z
dc.date.available2020-08-13T21:25:18Z
dc.date.issued2016
dc.fuente.origenConveris
dc.identifier.doi10.1002/app.43702
dc.identifier.issn0021-8995
dc.identifier.issn1097-4628
dc.identifier.urihttps://doi.org/10.1002/app.43702
dc.identifier.urihttps://repositorio.uc.cl/handle/11534/38622
dc.identifier.wosidWOS:000375468300020
dc.issue.numeroNo. 29
dc.language.isoen
dc.nota.accesoContenido parcial
dc.pagina.final43702-9
dc.pagina.inicio43702-1
dc.revistaJournal of Applied Polymer Sciencees_ES
dc.rightsacceso restringido
dc.subject.ddc620
dc.subject.deweyIngenieríaes_ES
dc.subject.otherPolimerización  Investigacioneses_ES
dc.subject.otherElectroquímicaes_ES
dc.subject.otherPolímeros - Investigacioneses_ES
dc.titleSynthesis and thermal, optical and morphological characterization of oligomeric polyamides based on thiophene and alkyl/phenyl-silane moieties. Study of the electrospum deposition processes_ES
dc.typeartículo
dc.volumenVol. 133
sipa.codpersvinculados189143
sipa.codpersvinculados1001668
sipa.codpersvinculados49327
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